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- De 145 000 $ à 165 000 $ par an
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Senior Design Engineer, Microelectronics and Advanced Packaging
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- Ingénierie
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Senior Microelectronics Process Engineer

Sanmina Corporation -
Ottawa, ON

Postuler dès maintenant

Détails du poste

De 145 000 $ à 165 000 $ par an

Profil recherché

Logiciels de CAO
Analyse des causes fondamentales des défauts
Soudage
Approvisionnement
Ingénierie
Maîtrise statistique des procédés
Recherche
Fabrication électronique
Maîtrise
Six Sigma
Emballage
Contrôle de la qualité
Mentorat
Analytique des données
Production
Génie manufacturier
Leadership
Production lean
Interaction avec les clients
Suivi de l'avancement des projets
Analyse de défaillance

Description complète du poste

Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.

At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.

Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.

Job Purpose

We are seeking an industry expert to lead the process architecture and development for our next-generation optical and microelectronic process solutions.

In this pivotal role, you will act as the technical anchor for our product solutions team. You will not simply run processes; you will define the assembly strategy from the ground up. Bridging the gap between R&D and high-volume manufacturing, you will own the end-to-end process lifecycle—from initial concept and recipe development to equipment selection and final release-to-manufacturing.

If you are a hands-on expert in flip-chip, wire bonding, and advanced optical packaging who thrives on solving complex device physics challenges, we want you to lead our technical vision.

Key Responsibilities

Process Architecture & Development

Define the Strategy: Conceptualize and develop comprehensive assembly strategies for complex optoelectronic modules, ensuring alignment with device physics, thermal requirements, and throughput goals.
Advanced Packaging Execution: Lead the hands-on development of critical process recipes, including Flip Chip, Underfill, Die Attach (epoxy & eutectic AuSn), and Wire Bonding (ball/wedge).
Equipment Leadership: Research, specify, and procure capital equipment. Oversee acceptance testing (SAT/FAT) to ensure new capabilities meet technological roadmaps.

NPI & Design for Manufacturability (DFx)

Design Partnership: Act as the primary feedback loop to the internal design team and external customers. Provide expert DFx (Design for Assembly/Manufacturing) guidance to optimize yield and reliability before prototypes are built.
Tooling & Fixturing: Conceptualize and drive the design of custom tooling and fixtures required for novel assembly techniques.
Customer Interface: Serve as the primary technical liaison for customers during the development phase, translating their requirements into viable manufacturing processes.

Quality, Analysis & Control

Rigorous Methodology: Implement robust process controls using PFMEA and Control Plans.
Root Cause Analysis: Lead complex troubleshooting efforts using methodical approaches (8D, etc.) to resolve yield excursions or performance issues.
Documentation: Author and approve high-level process assembly documentation and process qualification reports.

Mentorship & Leadership

Technical Mentorship: Act as a subject matter expert and mentor to junior and intermediate engineers, fostering a culture of technical excellence and best practices.
Project Management: Manage engineering timelines and milestones to ensure customer NPI builds are delivered on schedule.

Required Experience & Education:

Master’s Degree in Engineering (Materials, Electrical, Mechanical, or Physics).
Minimum 8+ years of direct, hands-on experience in microelectronics packaging and process engineering.
Core Competencies: deep expertise in Flip Chip and Wire Bonding (Chip & Wire) processes is non-negotiable.
Material Science: Strong understanding of material interactions, including underfills, epoxies, and gold-tin (AuSn) soldering/reflow processes.

Technical Skills:

Proficiency in programming automated assembly equipment (pick-and-place, dispensers, wire bonders).
Demonstrated experience driving Engineering Change Orders (ECOs) and process qualifications.
Strong background in statistical process control (SPC) and data analysis.

Preferred Assets:

Experience specifically within the Photonics/Microelectronics sector.
Proficiency with CAD tools (AutoCad, SolidWorks) for tooling design.
Knowledge of Lean Manufacturing and Six Sigma principles.

Why Join Us?

Impact: Work on cutting-edge technologies that are shaping the future of connectivity.
Location: Based in the heart of Canada’s tech hub in Kanata, ON.
Growth: A visible role with the opportunity to shape the engineering culture and technical roadmap of the organization.

OTHER INFORMATION

The compensation range for this position is $145,000 - $165,000 annually.
This position is for an existing vacancy.
The hiring process for this position does not use Artificial Intelligence (AI).

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.

Postuler dès maintenant

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